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Thomas Wire Die distributes high quality Hyprez® Diamond Polishing Compounds to
customers across Canada, including the highly versatile Hyprez Formula L.
Typical Applications:
• Grinding - tungsten carbide tools, ceramics, glass, cermets, PCD tools.
• Lapping - carbide and diamond wire drawing dies, glass components, metal seals.
• Polishing - ceramic and carbide valve seats and seals, optical components.
A comprehensive range of Hyprez Diamond Compounds has been developed to meet
all the variables involved in lapping and polishing. These include: |
• speed of equipment
• hardness of laps
• material being processed |
• working pressure applied to parts
• amount of stock to be removed
• size of area involved |
By using the proper Hyprez compound, in conjunction with the appropriate lapping and
polishing machines, plates and accessories, you are assured of consistent, repeatable
result of the highest quality.
For information on formulations available for your application, please contact Thomas
Wire Die. |
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